RUPNAGAR: Indian Institute of Technology, (IIT), Ropar has signed a memorandum of understanding( MoU) with University of Saskatchewan (USask), Canada Due to Covid-19 pandemic, the MoU signing ceremony was held online with the participation of representatives of all parties.
The MoU signing ceremony was held in the presence of Gene Makowsky, Minister of Advanced Education Saskatchewan, Dr. Baljit Singh, Vice President Research, USask, Patrick Hébert, Consul General of Canada in Chandigarh, Ms. Le Li, Senior International Specialist, USask, Dr. Prachi Kaul, Director, Shastri Indo-Canadian Institute.
With regard to the representatives of the Indian Institute of Technology(IIT), Ropar, the programme has the special presence of the Professor Rajeev Ahuja, Director, IIT Ropar, Prof. C.C.Reddy, Dean International Relations, IIT Ropar, Prof. Manoranjan Mishra, Dean Faculty Affairs and Administration, Prof. Navin Kumar, Dean Research, IIT Ropar and Lagvish Malhotra, Joint Registrar, International Relations, IIT Ropar.
Prof. Rajeev Ahuja, Director, IIT Ropar said that the MoU signing ceremony was a milestone for developing strong partnership in order to accomplish the future achievements in the areas like exchanges and internships for students, faculty, and staff, Introduction of new curricula, Joint research projects, Exchange of publications and training materials; and Development of joint academic programming.
Divulging more, Prof. Rajeev Ahujasaid, “The agreement is aligned with the internationalisation objective of the institute creating globally aware citizens through: the inclusion of international students and research collaborators; the promotion of student, faculty, and staff mobility; and the incorporation of local and global worldviews into our teaching and research.”
The MoU was followed by a workshop between faculty members of IIT Ropar and USask to explore the research areas and brainstorming sessions were carried out.
The workshop was conducted in 4 different breakout rooms. A few research areas were Computer Vision, Environmental protection; Geoenvironmental engineering; Wireless Body Area Networks, Modeling and design of high-speed on-chip, Medical Education, Mechanics of sustainable composite materials etc.